Description: Bake In Test (also known as “Burn-in”) is the process by which a PCBA is subjected to elevated temperature to force certain failures to occur under supervised conditions during the manufacturing process, to prevent failure in the field.

When possible, it is better to eliminate the root cause of early failures than doing a burn-in. Because of this, a process that initially uses burn-in may eventually phase it out as the various root causes for failures are identified and eliminated.

Bake-In Cycle Time is the summation of the time to load the heat profile on the oven chamber, load the PCBA, unload the PCBA, and inspect the PCBA. We assume that zero monitoring time is required.

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