Layer Material Configuration

With the PCB process group, an important part of material assignment is the specification of the material stack-up configuration. The setup option Layer Material Type Configuration allows you to choose a stack-up configuration represented as a sequence of the following elements (for multilayer boards):

• CU: single-foil copper. This represents a sheet of copper that is not clad to FR4 but will be pressed to an existing stack with prepreg during the layer processing cycles.

• 2PT: double ply core top. This represents a copper layer that is at the top of a double ply core.

• 2PB: double ply core bottom. This represents a copper layer that is at the bottom of a double ply core.

So, for example, the sequence CU CU 2PT 2PB CU CU represents the following material stack-up:

The red and gold horizontal bars (in rows labelled Layer:1-Layer:6) represent copper layers. The grey horizontal bar represents a core insulator. Prepreg occupies the regions between copper layers that are not occupied by a core insulator.

The only feasible single-layer configuration is represented as a single element:

• 1P: single ply core. This represents a copper layer that is part of a single ply core.

For more information, see Layer Material Type Configuration.