Category: Surface Mount
Description: Reflow is a Surface Mount (SMT) process in which components are held in place with solder paste while the PCB is heated to melt the solder to form the attachment between leads and pads. The heating process is typically divided into stages: preheat, soak, reflow, and cooling.
Major Cost Drivers -- PCBA Reflow
Process Time = Reflow Time + Unload Time
- Reflow Time = Reflow Oven Length/Reflow Oven Speed
// Time to move through reflow oven.- Reflow Oven Length = (Machine variable)
- Reflow Oven Speed = (Machine variable) // Time to move through reflow oven.
- Unload Time = Output Conveyor Length/Output Conveyor Speed
- Output Conveyor Length = (Machine variable)
- Output Conveyor Speed = (Machine variable)
User Inputs –- PCBA Reflow
Process specific: N/A
Global Inputs: PCB Length, PCB Width, PCB Thickness, PCB Weight