Computed Board Thickness
Computed board thickness is the thickness of the board as calculated from the thickness of each material, that is, as calculated from the thickness of each layer of copper, prepreg, or core insulation, as well as solder mask and silkscreen (if present). Computed board thickness is used to evaluate machine feasibility for several processes.
Computed board thickness is the sum of the following:
• Total copper thickness, which is the sum of the thicknesses of each Layer GCD.
• Total core insulator thickness, which is the sum of the Core Insulator Thickness for each copper layer.
• Total prepreg thickness, which is the sum of the prepreg thickness beneath each copper layer (see Prepreg Sheet Thickness Beneath Current Layer).
• Solder mask thickness: product of the following cost model variables:
o defaultNumSolderMaskSides (2 in starting point Digital Factories)
o defaultSolderMaskThickness 0.025mm in starting point Digital Factories)
• Silkscreen thickness: product of the following:
o Cost model variable defaultSilkscreenThickness (0.01mm in starting point Digital Factories)
The current value for computed board thickness is listed in the Process Options Editor for the Material Stock node.
