The Expose Photo Resist > Photolithography node of the Process Options Editor provides the following setup options:

Film mount time is the time to mount the mask through which a cooper layer’s photoresist is exposed to UV light. By default, film mount time is 0 for machines whose Direct Film Contact property is false.

For machines whose Direct Film Contact property is true, film mount time is specified by the cost model variable defaultFilmMountTime (15 seconds in starting point Digital Factories). Users can override the default on a per-part basis with the setup option Film Mount Time (defined by the Expose Photo Resist > Photolithography node of the Process Options Editor).

Film dismount time is the time to remove the mask from the photolithography machine after exposure of the photoresist on one side of the panel. By default, film dismount time is 0 for machines whose Direct Film Contact property is false.

For machines whose Direct Film Contact property is true, film dismount time is specified by the cost model variable defaultFilmDismountTime (10 seconds in starting point Digital Factories). Users can override the default on a per-part basis with the setup option Film Dismount Time (defined by the Expose Photo Resist > Photolithography node of the Process Options Editor).

Expose time is the time for which the photoresist on one side of a panel is exposed to light. By default, this time is specified by the cost model variable defaultPhotoResistExposeTime (20 seconds in starting point Digital Factories). Users can override the default on a per-part basis with the setup option Expose Time (defined by the Expose Photo Resist > Photolithography node of the Process Options Editor).